Apple recently announced the latest award from its $1B Advanced Manufacturing Fund. Finisar, a leading manufacturer of optical communications components, will receive $390M as part of Apple’s commitment to support innovation and job creation by American manufacturers.
Scientists at Ben-Gurion University of the Negev (BGU) are proposing a new method to obscure an optical chip by bending light around the object. This could be achieved by manipulating waves in the near field region (such as surface plasmons) of a metamaterial surface (a metasurface) on an integrated photonic structure.
Layered two-dimensional materials that are as efficient, but thinner than, silicon semiconductors, could power future electronic circuits and devices, according to Stanford researchers.
Flexible hybrid electronics (FHE) is a category of microelectronics using novel materials with stretchable, conformable, and flexible form factors. FHE enables wearables, medical Internet of Things (IoT) applications, defense applications, and more by shifting from electronics based on rigid and fragile circuit boards to flexible electronics components mounted on substrates, such as plastics and textiles.
Engineers at the California Institute of Technology (Caltech) have designed and fabricated a unique type of retroreflector built from stackable metamaterials using computer-chip manufacturing technologies, allowing them to be integrated into optoelectronic devices.
Researchers at the University of Wisconsin–Madison (UW-Madison) and the University at Buffalo (UB) have developed a very thin yet high-performance photodetector consisting of nanocavities sandwiched between a single-crystalline germanium and a reflective layer of silver.
Researchers have developed a new kind of photodetector that utilizes its built-in semiconducting heterojunction to power itself, rather than rely on external voltage, as typical photodetectors do.